CDK manufactures products with high quality and reliability by own know-how and design skills, which have been cultivated in closely cooperating with major manufacturers. For now, we are moving forward as a manufacturer covering from design, development, and production consistently.
Hollow Packaging
CDK's original hollow packaging technology to produce an ideal air structure for the RF signal at around the semiconductor die. Due to this, ultra-low noise HEMT which receives radio waves of satellite broadcasting can amplify waves with high efficiency. CDK has high-throughput manufacturing line, and have manufactured record 50M pcs in the past.
RF Testing
In semiconductor devices for wireless communication products, variety performance test is performed. Moreover, RF test result is very sensitive to test environment. CDK has own know-how, so we can provide to high-throughput RF testing for mass product with high accuracy.
Die attach (Power Amplifier)
High power amplifier for sending signal is used to base station of smartphone. CDK was automatized die attach process for power FET such as GaN and LDMOS. As a result, it can be produced in a stable low-cost high power amplifier.
CDK products and services
RF Semiconductors OSAT
CDK manufactures products with high quality and reliability by own know-how and design skills, which have been cultivated in closely cooperating with major manufacturers.
Package lineup
Original Semiconductor Products
We develop RF device for wireless communication. One is ultra-low noise HEMT in the reception for satellite broadcasting, which receives weak radio waves from aerospace with high sensitivity and amplifies. And the other is Switch IC of wireless LAN, which performs switching of transmission and reception in the network connection, such as PC.
Reliability Test Service
CDK evaluates product quality from every angle drawn on our semiconductor manufacturing technologies and experiences.
RF semiconductor product which requires experties will be supported by our specialized staff.
- CDK Pickup
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This tiny semiconductor on the finger tip is installed in the signal receiving part of wireless communications.
So-called Hollow package of CDK's production technology is applied in here. -
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