Process Flow
- Front end
- Wafe
Processing - Die
Attach - Wire
Bonding - Hollow
Packaging - Testing
- Taping
Package lineup
CDK offers a wide range of package lineup, with over 40 years of RF products mass production.
So-called Hollow packages are based on our own production technology.
Assembly Technology
CDK offers a wide range of package lineup.
We always provide Japan quality assembly solution for customers.
Testing Technology
CDK has a wide range of RF test equipments.
We always provide Japan quality testing solution for customers.
